Hello,I'm looking for a way to perforate a model evenly over the entire surface so that water can be sucked through, similar to a sieve.Now I had already tried to implement this in the modeling software, but this quickly broke down with larger, more complex surfaces. The next approach was to omit the walls, top, bottom in the slicer (Cura) and only print a 'wall' of infill. The pattern is connected lines. The alternating loops that result create a hole structure that allows water to be sucked through the surface. The only problem is that the surface as a whole becomes very rough and bumpy. In addition, it is only possible to suck the water through the loops at an angle, which is not optimal for the specific purpose. If another slicer seems more capable for the task for you I would happily change. I have only tried Cura so far.It's a bit tricky and I can't think of a better solution right now, but maybe one of you has a brilliant idea.