A major growth area is that of 3D printing electronics, and researchers in Texas have been looking at a new approach. A research paper from a team out of the Department of Mechanical Engineering at Southern Methodist University introduces a 3D printing process called FEAM -- Fiber Encapsulation Additive Manufacturing. FEAM technology could extend to both electronics and non-electrical printing applications, as it uses a method that extrudes molten plastic at the same time as a fiber, encapsulating the fiber within the printed layer. Find out more about the research and its potential applications in the full article: http://3dprint.com/53785/feam-3d-print-wires/


Below is an image from the research paper illustrating the FEAM process: