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03-30-2015, 09:31 AM #1
New FEAM 3D Printing Proces Outlined in Report
A major growth area is that of 3D printing electronics, and researchers in Texas have been looking at a new approach. A research paper from a team out of the Department of Mechanical Engineering at Southern Methodist University introduces a 3D printing process called FEAM -- Fiber Encapsulation Additive Manufacturing. FEAM technology could extend to both electronics and non-electrical printing applications, as it uses a method that extrudes molten plastic at the same time as a fiber, encapsulating the fiber within the printed layer. Find out more about the research and its potential applications in the full article: http://3dprint.com/53785/feam-3d-print-wires/
Below is an image from the research paper illustrating the FEAM process:
Print not sticking to base plate?
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