As researchers around the world work together in the area of 3D printing, security and issues regarding file and print integrity have come to light. We reported previously on concerns raised by the engineering team at New York University Tandon School of Engineering regarding cyberterrorism and the ease with which defects could be planted—unnoticed—in a print; for example, a defect could be caused in between 3D printing layers. Now, the University of North Dakota is taking up where they left off, offering a solution as they focus on assessment and analysis of 3D prints. While this is still sensor-based, the system allows for the assessment even of micro-structures and can be used with any position-correlated pixel-based sensing technology. Read more at 3DPrint.com: https://3dprint.com/144490/cyberterr...d-3d-printing/